Thermal Engineer (Starlink)

About the role

You will oversee the thermal architecture for Starlink hardware, ranging from phased array antennas to custom silicon. This role requires managing thermal performance across diverse environments, from consumer homes to high-speed transit. You are responsible for defining the thermal strategy that ensures reliability and performance across the entire Starlink hardware portfolio. The position demands a deep understanding of heat transfer principles as they apply to dense electronic systems operating in varied climates. You will translate complex system requirements into actionable thermal solutions that protect sensitive components. Collaboration is central, as you will work to align thermal objectives with the goals of multiple engineering disciplines. Your analysis will directly influence the durability and user experience of critical satellite ground equipment and user terminals. This is a hands-on role where theoretical calculations meet the realities of deployment in the field.

Key facts

What you'll do

• Architect thermal systems for next-generation gateways, consumer wireless devices, and phased arrays, ensuring optimal heat dissipation under all operating conditions.
• Manage the thermal design of semiconductor packages, moving from conceptualization to simulation and physical testing to validate thermal performance and reliability.
• Design and execute validation tests to ensure hardware integrity under extreme environmental conditions, including rapid temperature cycling and sustained high-heat scenarios.
• Streamline design workflows through automation to minimize engineering overhead and accelerate the development of thermal solutions.
• Apply first-principles analysis to assess design impacts and sizing requirements, calculating thermal resistances and predicting system behavior with scientific rigor.
• Document design specifications and provide technical recommendations to improve system performance, creating clear records for future development and manufacturing.
• Coordinate closely with electrical, mechanical, software, and RF engineering departments to ensure thermal constraints are considered throughout the product development lifecycle.
• Utilize advanced thermal simulation tools to model heat flow and identify potential hotspots before physical prototypes are built.
• Evaluate and recommend new materials and thermal interface solutions to enhance heat transfer and improve the longevity of critical components.
• Support the development of standards and best practices for thermal management across the Starlink engineering organization.

Requirements

• Bachelor degree in an engineering field, with a strong foundation in thermodynamics, heat transfer, and fluid mechanics principles.
• Minimum of 1 year of experience in electromechanical or mechanical design and analysis, including project or internship work that involved real-world thermal challenges.
• Ability to work weekends and extended hours as required to meet critical project milestones and respond to urgent operational needs.
• U.S. citizenship, lawful permanent residency, refugee, or asylee status is mandatory due to the ITAR-controlled nature of the hardware and technologies involved.
• Proven capability to analyze thermal problems and develop practical engineering solutions that balance performance with cost and manufacturability.
• Willingness to adhere to SpaceX's strict quality and safety standards for all thermal design and testing activities.
• Strong analytical skills to interpret test data and adjust thermal models to reflect real-world performance accurately.
• Effective time management skills to handle multiple design iterations and testing cycles within aggressive project timelines.

Nice to have

• Master degree in a relevant engineering discipline, providing advanced knowledge of thermal analysis and computational methods.
• 1+ years of experience with Python or MATLAB for automating analysis tasks and processing test data.
• Proficiency in ANSYS Workbench and Thermal Desktop for creating detailed simulations of thermal systems.
• Experience with chip-level thermal tools such as Icepak or Flotherm for analyzing complex electronic cooling scenarios.
• Background in reduced order and 3D thermal modeling to balance detailed analysis with computational efficiency.
• Strong written and verbal communication skills for clearly presenting technical findings to cross-functional teams.
• Capacity to meet tight project deadlines while maintaining a high standard of work under pressure.

Skills & tools

• Thermal simulation software
• Scientific programming
• Semiconductor packaging thermal design
• First-principles analysis

Practical notes

• This position is subject to U.S. export control laws (ITAR). Applicants must be U.S. citizens, lawful permanent residents, refugees, or asylees.
• SpaceX is an equal opportunity employer. Requests for reasonable accommodations or access to the Affirmative Action Plan can be directed to EEOCompliance@spacex.com.