Sr. IC Packaging Test Engineer, Silicon Technology

About the role

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars. Starlink believes in providing fast, reliable internet to those that need it most. We design, build, and launch the world's largest and most advanced satellite constellation that is capable of delivering high-speed internet to even the most remote locations. We also design, build, and ship the hardware that sits in the homes of our customers all around the world. And while our hardware and network are incredibly advanced, we keep the end-user experience impressively simple - our customers have internet within 10 minutes of unboxing. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for talented hands-on and dynamic test engineers with expertise in semiconductor packaging and wafer test. You will work closely with test equipment manufacturers and in-house chip and system designers to develop and release production test solutions. You will assume full ownership of packaged component and wafer test as we strive to make Starlink more affordable to those that need it most.

Key facts

What you'll do

Investigate and define electrical test requirements for advanced packaging and wafer level production testing.

Evaluate and bring up new test equipment and test programs to achieve mass manufacturing readiness.

Architect and create automated test equipment (ATE) test programs and comprehensive test plans.

Develop and define full testing requirements to ensure strict product conformance and reliability.

Perform schematic and electrical review for all test equipment and test setups.

Partner with suppliers to implement test interface solutions that drive feature, cost, and productivity improvements.

Deploy and implement advanced testing solutions tailored for SpaceX next generation products.

Collaborate with chip and system designers to align test strategies with product architecture.

Optimize test flows to improve throughput and yield while maintaining high quality standards.

Troubleshoot complex test failures using advanced diagnostic techniques and data analysis.

Validate test programs to ensure they meet functional, parametric, and RF performance criteria.

Support the qualification and release of new packaging technologies for production.

Document test methods, results, and procedures to maintain clear and traceable records.

Lead root cause analysis for test anomalies and drive corrective actions to closure.

Contribute to the continuous improvement of test infrastructure and automation frameworks.

Requirements

Bachelor's degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline.

5+ years of programming experience in C/C++/Visual/Python.

10+ years industry experience with microelectronics packaging development.

Advanced technical degree is preferred.

Expertise in developing digital, high-speed and RF semiconductor test programs for production.

Strong RF test knowledge and practical application experience.

Experience with digital, high speed SERDES, RF, and mixed signal testing methodologies.

Wafer sort, wafer probe, probe card design and test experience is required.

Custom socket and wafer prober design and test experience is essential.

Semiconductor functional and parametric test design and development background required.

Digital waveform and test plan programming development skills are necessary.

Ability to work extended hours or weekends as needed for mission critical deadlines.

U.S. citizenship or eligibility for ITAR authorization is required.

Nice to have

Experience with probe card development and advanced test methodologies.

Knowledge of semiconductor manufacturing processes and yield analysis.

Background in quality systems and reliability testing.

Familiarity with failure analysis techniques and tools.

Experience with high-speed digital design and signal integrity analysis.

Practical notes

This role requires extended work hours and weekend availability during critical mission deadlines.

Applicants must be authorized to work in the United States without sponsorship.

Travel is not required for this position.

Visa sponsorship is not available for this role.

Additional Requirements

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. 1158, or be eligible to obtain the required authorizations from the U.S. Department of State.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status. Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities may request it by contacting HR or emailing careers@spacex.com. Candidates are also invited to search spacex.com/careers for current opportunities or to submit an application for future openings.