Senior RF engineer

About the role

QuantWare is constructing the world's most powerful quantum processors to solve humanity's greatest challenges using a unique VIO™ technology that breaks hardware barriers and unlocks the path to MegaQubit quantum processors. This role demands a candidate who does not shy away from tackling the hardest challenges of our time and who is ready to drive critical hardware innovation. As the Senior RF engineer, you will take full ownership of the end-to-end design, verification, and scaling of our foundational flex cable interface within the core VIO technology stack. You will bridge cutting-edge RF engineering with hands-on project management while acting as the primary technical interface with strategic vendor partners to drive co-innovation. The position requires balancing high-frequency RF performance, mechanical reliability, and high-volume manufacturability in support of our R&D roadmap. Your work will directly enable hyper-scale quantum computers that change the world.

Key facts

What you'll do

Drive the full lifecycle of flex interconnect systems across product generations, from early-stage conceptualization through verification, qualification, and high-volume manufacturing.

Maintain high signal integrity and RF performance while ensuring long-term mechanical reliability, durability, and thermal performance under demanding operational conditions.

Work directly with external partners and suppliers to push the boundaries of flex design and manufacturing capabilities, translating complex RF, mechanical, and system-level specifications into unambiguous technical requirements.

Translate intricate system-level requirements into clear technical specifications and secure firm commitments from vendors to ensure aligned deliverables.

Own supplier development schedules, ensuring critical components are delivered on time without compromising quality or yield across the supply chain.

Drive internal project execution by setting schedule milestones, tracking deliverables, and keeping cross-functional teams accountable to QuantWare's ambitious roadmap.

Lead, mentor, and grow an engineering team dedicated to flex interconnect development and RF integration while influencing multi-disciplinary teams without formal direct-report authority.

Balance trade-offs between high-frequency RF performance, mechanical robustness, and manufacturability to support rapid iteration and scaling efforts.

Act as the central technical authority for flex interconnects, making key decisions that impact VIO technology and the broader quantum processor architecture.

Champion continuous improvement by identifying risks early, implementing mitigation strategies, and driving lessons learned across hardware development cycles.

Collaborate closely with R&D, system engineering, and manufacturing teams to align flex solutions with evolving product requirements and production capabilities.

Ensure that flex cable solutions meet stringent verification and qualification standards before transitioning to high-volume production environments.

Support the definition of test methodologies and validation protocols that verify RF integrity, mechanical durability, and thermal stability over the product lifecycle.

Promote best practices in RF engineering, supplier collaboration, and project management to elevate the overall maturity of flex interconnect development at QuantWare.

Requirements

4+ years of hands-on experience in RF engineering, signal integrity, or high-frequency interconnect design, including work with flex circuits, rigid-flex configurations, and micro-coaxial interfaces.

Deep hands-on experience with standard RF simulation software such as HFSS, CST, or ADS, as well as RF measurement equipment including VNAs, Spectrum Analysers, and TDR tools.

Proven Track Record of leading hardware or R&D engineering projects from initial concept through verification to volume production without compromising performance or yield.

Direct experience managing external vendors, JDM partners, or component suppliers to deliver complex custom electro-mechanical parts that meet strict specifications.

Exceptional communication and alignment skills, with the ability to direct and influence multi-disciplinary teams effectively even in the absence of formal direct-report authority.

Strong understanding of mechanical reliability, thermal performance, and signal integrity trade-offs in high-frequency interconnect systems.

Comfort working in a fast-paced, ambitious environment where priorities evolve rapidly and problem-solving is driven by first principles.

Experience designing hardware for superconducting circuits and cryogenic environments is considered a bonus but is not mandatory for this role.

A demonstrated commitment to quality, schedule, and collaboration within cross-functional, matrixed team structures.

Willingness to engage deeply with technical and strategic vendor partners to negotiate specifications, resolve issues, and drive innovation.

An ability to translate abstract system requirements into concrete engineering tasks that vendors can execute with clarity and confidence.

Passion for advancing quantum computing hardware and contributing to solutions that address humanity's greatest challenges.

Nice to have

Only items indicated as preferred in the SOURCE are included, such as experience with superconducting circuits and cryogenic environments as a bonus.

Practical notes

Candidates should be willing to engage with international vendors and travel as required within project timelines.

Visa sponsorship may be considered for eligible candidates depending on immigration requirements.

Applications will be reviewed continuously until the position is filled, so early submission is encouraged.