Senior 3D Packaging & Tooling Engineer

About the role

QuantWare develops high-performance quantum processors using proprietary VIO technology to overcome existing hardware limitations. This role focuses on the physical realization of our quantum architecture by adapting precision assembly equipment for non-standard 3D integration. You will serve as the primary technical lead for assembly processes, ensuring our hardware meets the rigorous tolerances required for quantum computing. In this capacity, you will act as the central point of authority for all mechanical and process decisions related to advanced packaging. Your work will directly translate architectural concepts into manufacturable physical stacks through innovative tooling solutions. You will be responsible for pushing the boundaries of current assembly techniques to enable the next generation of quantum processors. The position demands a deep understanding of mechanical stability and thermal performance in multi-die environments. Ultimately, your contributions will define the manufacturability and reliability of our core quantum hardware.

Key facts

What you'll do

• Modify and customize high-precision assembly hardware, such as die attach systems and flip-chip bonders, to support unique 3D integration needs.
• Create sub-micron bonding and placement processes, including laser-assisted, thermo-compression, and coldwelding techniques.
• Select and test adhesives, glues, and solder materials capable of maintaining stability in high-vacuum and cryogenic dilution refrigerator environments.
• Design strategies for non-standard 3D assembly, including vertical chip placement, interposer-based architectures, and multi-die stacking.
• Manage relationships with equipment vendors to drive the co-development of specialized manufacturing hardware.
• Establish robust characterization methodologies to validate the mechanical integrity of 3D packages under operational stress.
• Optimize thermal pathways to ensure heat dissipation across vertically integrated quantum die without compromising signal integrity.
• Implement rigorous inspection protocols to detect defects at the sub-micron level before modules are integrated into larger systems.
• Collaborate with theoretical physicists to model mechanical stress distributions and predict long-term package reliability.
• Document all procedures and standards to ensure reproducibility and compliance with internal quality frameworks.
• Lead failure analysis investigations to identify root causes of packaging defects and drive corrective actions.
• Interface with the R&D team to provide feedback on design for assembly (DFA) improvements.
• Support the development of automated test setups to accelerate the validation of new packaging configurations.
• Act as a technical consultant for junior engineers and technicians working on assembly floor operations.

Requirements

• BS, MS, or PhD in Mechatronics, Mechanical Engineering, Materials Science, or Physics.
• Minimum of 7 years of hands-on experience operating and modifying high-accuracy semiconductor assembly platforms.
• Demonstrated ability to achieve placement accuracy of less than 1 micron, ideally reaching 0.5 microns.
• Technical background in 3D integration, specifically regarding micro-bumps, TSVs, or interposers and their behavior under thermal stress.
• Experience with material performance in extreme vacuum or cryogenic conditions.
• Proven track record of solving complex mechanical problems in a high-tech manufacturing environment.
• Strong understanding of the limitations and capabilities of current flip-chip and die attach machinery.
• Ability to work independently with minimal supervision while maintaining strict adherence to quality standards.

Skills & tools

• High-precision assembly platforms (flip-chip bonders, die attach machines)
• Sub-micron placement processes
• Thermo-compression bonding
• Laser-assisted bonding
• Coldwelding
• 3D integration (TSVs, micro-bumps, interposers)
• Cryogenic and high-vacuum material science

Practical notes

• Compensation includes a competitive salary plus an 8% holiday allowance.
• Benefits include a pension plan with partner and dependent coverage, a personal budget for professional development, and a flexible hybrid work model with an open vacation policy.
• The company prioritizes diversity and encourages applications from women in the quantum industry.
• Candidates may be subject to pre-employment screening as part of the hiring process.
• The position is based in Delft, requiring availability for work in that location.
• Travel is not required for this role.
• This role is not eligible for remote work arrangements outside of the Netherlands.
• Applicants must meet all listed requirements to be considered for an interview.
• The selection process may include technical assessments and interviews with senior engineering staff.