Principal Packaging Engineer

About the role

Velaura seeks a Principal Packaging Engineer to define the foundational architecture for next-generation System-on-Chips. This position requires ownership of the entire package lifecycle, from initial concept definition through high-volume manufacturing execution. The role demands leadership across disciplines, including silicon, board-level integration, system engineering, thermal management, and mechanical design. Success hinges on the ability to balance competing priorities to deliver solutions that are technically卓越, cost-optimized, and manufacturable at scale. The incumbent will set the technical direction and ensure alignment between design intent and production reality. This position is based in Santa Clara, California.

Core Responsibilities

The Principal Packaging Engineer will drive technical decisions that define the physical manifestation of semiconductor dies within complex systems. Primary duties include creating and validating substrate layouts and assembly methodologies that satisfy demanding performance, cost, and yield criteria. The role requires close coordination with fabrication partners to ensure package specifications are compatible with high-volume production processes. A critical function is the evaluation of thermal behavior and mechanical stress to guarantee product durability across the full spectrum of operating conditions. The engineer will lead signal integrity strategies, focusing on dense interconnect routing and the optimization of high-speed interface channels. Collaboration with system architects is essential to strike a balance between functionality, form factor, and manufacturing risk. The position involves the creation of test structures and characterization vehicles used to validate package behavior prior to production ramp-up. This includes guiding material selections and supplier choices to support high yield and long-term product stability. The role further defines measurement setups and test methodologies to verify electrical characteristics throughout the development cycle. When field issues emerge, the engineer will collaborate with cross-functional teams on diagnostic data to identify root causes and refine existing designs. A key responsibility is the documentation of all packaging decisions, trade-offs, and verification results for both internal stakeholders and external partners.

Required Qualifications

The candidate must possess hands-on experience with advanced semiconductor packaging techniques and established methodologies. A deep understanding of how substrate choices influence routing density, grounding strategies, and thermal performance in complex systems is mandatory. The engineer must be able to interpret detailed electrical specifications and translate them into concrete physical package constraints and design rules. Demonstrated familiarity with semiconductor assembly processes and their influence on design decisions is required. The candidate must exhibit a proven ability to work effectively within cross-functional teams to analyze and resolve technical trade-offs. Experience in signal integrity analysis, particularly concerning power delivery networks and high-speed paths, is essential. A thorough knowledge of mechanical constraints and thermal pathways that impact package reliability and longevity is necessary. Clear communication skills are required to convey complex technical concepts to engineering groups using precise and accurate language.

Additional Qualifications

Experience in high-volume manufacturing environments is highly valued. Candidates with a background in cost optimization strategies for high-volume production will have a distinct advantage.

Compensation and Benefits

This role offers a total compensation package ranging from 190,000 USD to 260,000 USD on a yearly basis. This position is designated as full-time employment.

Practical Information

Applicants are advised to confirm specific application procedures and requirements on the official company career portal.

What you'll do

• Execute the technical responsibilities designated for the as outlined on the official career portal.
• Adhere strictly to the scope, guidelines, and procedures detailed
• Define the foundational architecture for next-generation System-on-Chips through advanced packaging methodologies.
• Own the entire package lifecycle, managing activities from initial concept definition through high-volume manufacturing execution and validation.
• Provide leadership across multidisciplinary teams, including silicon engineering, board-level integration, system engineering, thermal management, and mechanical design.
• Balance competing technical and business priorities to deliver solutions that are robust, cost-optimized, and manufacturable at scale without compromising quality.
• Set the definitive technical direction for packaging initiatives and ensure rigorous alignment between design intent and production reality.
• Create, validate, and iterate upon substrate layouts and assembly methodologies that meet exacting demands for performance, cost, and yield.

Practical notes

This Principal Packaging Engineer listing at Velaura specifies Santa Clara, CA. Confirm remote work policy, exact compensation details, and the precise start date by reviewing the official career portal. Prospective applicants must consult the official posting to verify current duties, compensation figures, and location specifics for this position.