Sr. Silicon Packaging Process Engineer, Silicon Technology

About the role

SpaceX is at the forefront of revolutionizing satellite technology, and as part of this mission, we are bringing the assembly and packaging of integrated circuits in-house to enhance our Starlink satellite constellation. This position is centered around the development and scaling of semiconductor packaging processes, guiding them from the initial design phase all the way to high-volume production. You will be responsible for managing the entire lifecycle of packaging modules, with a focus on improving both the cost-effectiveness and performance of Starlink hardware.

Key facts

What you'll do

• Oversee the workflows involved in packaging assembly, which includes the procurement of materials and equipment necessary for chip-level and wafer-level systems.
• Set technical benchmarks for various processes, including but not limited to wafer dicing, grinding, lithography, lamination, etching, plating, surface mount technology (SMT), molding, underfill, bonding, and solder ball attachment.
• Spearhead the introduction of innovative products and technologies into our assembly lines, ensuring seamless integration.
• Supervise the development of prototypes and facilitate the transition of designs into mass production environments.
• Enhance production efficiency by focusing on cost reduction, yield improvement, quality assurance, and reliability metrics.
• Collaborate with external vendors for materials and equipment to promote productivity and ongoing enhancements.
• Work closely with teams in thermal management, materials science, integrated circuit design, and systems engineering to incorporate advanced packaging solutions into upcoming hardware projects.
• Conduct thorough analyses and evaluations of packaging processes to identify areas for optimization and improvement.

Requirements

• A bachelor's degree in materials science, mechanical engineering, electrical engineering, physics, chemical engineering, or a closely related engineering discipline.
• A minimum of five years of hands-on experience in semiconductor packaging and assembly processes.
• Strong understanding of semiconductor manufacturing techniques and the ability to apply this knowledge in a practical setting.
• Proven track record of managing projects in a cross-functional team environment, demonstrating effective communication and leadership skills.
• Familiarity with industry standards and best practices in semiconductor packaging.
• Ability to work in a fast-paced environment while maintaining attention to detail and meeting project deadlines.

Nice to have

• An advanced degree in a relevant technical field.
• At least seven years of experience in the microelectronics packaging sector.
• Expertise in various packaging technologies such as System in Package (SiP), Ball Grid Array (BGA), flip-chip, Wafer-Level Chip Scale Package (WLCSP), fan-out, chiplet integration, and panel-level packaging.
• Direct experience with printed circuit board assembly (PCBA), printed circuit boards (PCB), or surface mount technology (SMT) assembly processes.
• Experience working with Outsourced Semiconductor Assembly and Test (OSAT) providers.
• Knowledge of current trends and advancements in semiconductor packaging technology.

Skills & tools

• Proficient in the development of semiconductor assembly processes.
• Skilled in selecting appropriate equipment and materials for both wafer and chip-level packaging applications.
• Experienced in New Product Introduction (NPI) and New Technology Introduction (NTI) line setup and management.
• Strong project management capabilities, particularly in cross-functional team settings.
• Familiarity with data analysis tools and methodologies to assess and improve packaging processes.

Practical notes

• This position is subject to U.S. Government export regulations (ITAR). Candidates must be U.S. citizens, lawful permanent residents, refugees, or asylees, or otherwise meet eligibility criteria for U.S. Department of State authorization.
• SpaceX is committed to diversity and is an Equal Opportunity Employer. We provide reasonable accommodations for the application process upon request. For assistance, please reach out to EEOCompliance@spacex.com.

Join us at SpaceX and be a part of a team that is pushing the boundaries of technology and innovation in the aerospace industry. Your expertise in silicon packaging processes will play a vital role in shaping the future of satellite communications.

About the company

Based in Starbase, Texas, a company pursues work in spaceflight, telecom, and artificial intelligence. A unit handles rocket launches, leading yearly orbital counts beyond other national and commercial teams. Another unit runs Starlink, a satellite communications firm. A third area, through SpaceXAI, advances Grok and AI integration with X, while managing data center operations. Roles often cross these paths. Candidates with engineering, software, or operations backgrounds may find chances to join projects that span launch, connectivity, and machine learning efforts in this Texas-based enterprise.