Director, System in Package Architecture

About the role

The role leads cross-functional strategy and execution to move complex semiconductor products from design to launch. Success in this position drives integration roadmap and partnerships that shape next generation memory systems. You will define the technical boundaries for System in Package solutions, ensuring that product strategies are executable and aligned with business goals. This position owns the end-to-end integration strategy, balancing performance, cost, and risk across engineering teams. You will act as the primary architect for high-bandwidth memory systems, influencing both internal stakeholders and external partners. The role requires a proactive approach to removing dependencies and fostering collaboration to keep projects on track. Ultimately, your decisions will set the direction for advanced packaging capabilities and long-term product competitiveness.

Key facts

What you'll do

Strategic architecture direction is set for System in Package and High Bandwidth Memory performance, defining modules and integration approaches.

Mechanical and electrical test vehicles are designed and developed to validate packaging concepts when necessary.

Technical strategies are articulated through exceptional verbal and written communication to stakeholders and partners.

Requirements

A BS in Electrical Engineering or equivalent combination of education and progressive industry experience is mandatory.

At least 7 years of specialized experience in advanced packaging architecture definition, strategy, and development is required.

Demonstrated success aligning engineering, product, and operations teams on complex packaging delivery is required.

Proven ability to lead, mentor, and scale high-performing engineering teams, with managing managers or team leads preferred.

Clear, persuasive articulation of technical strategies in verbal and written form is required.

At least 10 years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies, is required.

Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies is required.

Strong proficiency in Signal Integrity and Power Integrity analysis and optimization is required.

Direct experience with High Bandwidth Memory architecture and integration is highly desirable.

Practical notes

Employment is at-will and subject to SK hynix America policies and global practices.

Onsite work model applies, with team collaboration at the San Jose location.

Typical interview steps

Leadership hiring usually includes a strategy case, a people scenario, and a values conversation. Candidates may be asked to turn around a struggling team or plan for growth. Past results are examined closely, especially how decisions were made. Interviewers dig into specific decisions you made and their consequences. Preparing two or three decision stories with numbers and lessons is the best use of time.

Good to know

Advanced packaging defines how components connect in compact modules, and System in Package designs combine logic and memory to boost performance.

High Bandwidth Memory architecture moves data efficiently between processors and memory through wide interfaces and tight integration.

2.5D and 3D packaging techniques stack and interconnect dies using substrates and through-silicon vias to enable higher bandwidth in smaller footprints.

Signal Integrity and Power Integrity analyses reduce noise, reflections, and voltage droop at high frequencies across packaging and board-level systems.

Semiconductor development relies on cross-functional coordination among design, test, product, and operations teams to hit demanding schedules and quality targets.

Questions to ask

Useful questions for the interview: what a typical week looks like, how work is assigned, what tools the team uses, and how feedback works. Asking how the role has changed recently and what the team wishes it had known when joining is also reasonable. Questions about the manager's priorities are especially valued.

Career growth

Leadership careers move from manager to senior manager, director, and executive roles. Each step adds more scope and more responsibility for outcomes. The best leaders keep learning how to delegate, communicate, and decide. Leadership careers reward a record of building and developing people. The higher you go, the more your communication shapes the whole organization.