Quantum Advanced Packaging Engineer

About the role

QuantWare is seeking an Advanced Packaging Engineer to spearhead the research and development of chiplet and 3D architecture systems for scalable quantum processors. This role involves designing, fabricating, prototyping, assembling, and testing critical components of next-generation quantum computers. You will guide the development of chip layers from initial concept to final implementation, significantly advancing our quantum hardware.

Key facts

What you'll do

• Drive R&D from initial concepts to manufacturable processes, including hands-on contributions to new packaging and assembly techniques.
• Lead and mentor the development of advanced packaging methods for quantum hardware applications.
• Collaborate with external partners and vendors, overseeing outsourced activities and integrating external technologies.
• Strategically allocate resources and time, balancing workloads, coordinating cross-functional efforts, and aligning priorities with company goals.
• Cultivate a culture of innovation and accountability, ensuring technical excellence within a fast-paced scale-up environment.

Requirements

• Master's degree or higher in physics, electronics, materials science, or a related discipline.
• 4+ years of hardware R&D experience, preferably in semiconductor packaging development.
• Demonstrated ability to solve complex technical challenges.
• Proven track record of leading R&D activities in a relevant field.
• Strong communication skills for presenting complex development challenges and projects.
• Comfortable establishing scalable processes in a startup or scale-up setting.
• Excellent communication skills for engaging engineers and business stakeholders.
• Good management skills, including coaching, talent development, and conflict resolution.

Nice to have

• Experience with semiconductor processing, chip integration, flip-chip, or advanced packaging techniques.
• Knowledge of packaging simulation tools, thermal management, mechanical stress, and reliability in complex hardware systems.

Skills & tools

• Semiconductor packaging
• 3D architecture
• Chiplet technology
• Fabrication methods
• Assembly techniques
• Thermal management
• Mechanical stress analysis

Practical notes

QuantWare offers a competitive salary, a generous pension plan including partner and dependent coverage, and flexible hybrid work arrangements with an open vacation policy. A dedicated budget is provided for personal learning and development. The company fosters a connected team through events and offsites. Pre-employment screening may be required. QuantWare encourages applications from diverse candidates, especially women in quantum, even if not all requirements are met.